Taiwan Semiconductor Manufacturing Company (TSMC) is considering expanding its advanced packaging capacity in Japan, Reuters reported on Monday, citing sources familiar with the matter.
The move would support Japan’s efforts to revitalise its semiconductor industry.
TSMC is exploring the possibility of bringing its Chip-on-Wafer-on-Substrate (CoWoS) packaging technology to Japan, a high-precision method that stacks chips to enhance processing power and efficiency.
Currently, all of TSMC’s CoWoS capacity is in Taiwan.
No final decisions have been made on the investment scale or timeline. The demand for advanced semiconductor packaging has increased globally, driven by the rise of artificial intelligence.
TSMC plans to double its CoWoS output this year and further increase it by 2025. The company recently announced plans to expand advanced packaging capacity in Chiayi, Taiwan, in response to market demand.
CoWos is an innovative packaging method that entails stacking multiple chips on top of each other on a wafer, according to Techovedas website.
